Facilities & Equipment

Tools for growthEvidence for devices

EPID integrates materials synthesis, device fabrication, and multimodal characterization in one experimental workflow.

17 instruments and systems

Category 01

Growth & deposition

Thin-film growth, epitaxy, metallization, and controlled thermal processing.

01.01
MIST CVD equipment

Laboratory system

MIST CVD

  • Sequential mist generation
  • Process temperature up to 1,000 °C
  • Ga₂O₃, Al₂O₃, IrO₂, and other oxide materials
01.02
MIST CVD — 2nd system equipment

Laboratory system

MIST CVD — 2nd system

  • Sequential mist generation
  • Process temperature up to 1,000 °C
  • 4-inch wafer capability
  • Ga₂O₃, Al₂O₃, IrO₂, and other oxide materials
01.03
Thermal / plasma-enhanced ALD equipment

Laboratory system

Thermal / plasma-enhanced ALD

  • Al₂O₃ uniformity ±1% on a 200 × 200 mm² substrate
  • Base pressure below 5.0 × 10⁻³ Torr
  • Al₂O₃, ZrO₂, HfO₂, and HfZrOₓ
01.04
RF/DC co-sputtering system equipment

Laboratory system

RF/DC co-sputtering system

  • Load-lock configuration
  • Substrate heating to 400 °C; 500 °C maximum
  • RF and DC gun power supplies
  • Base pressure 5.0 × 10⁻⁶ Torr
01.05
Facing-target sputtering system equipment

FTS

Facing-target sputtering system

  • DC source
  • Base pressure 1 × 10⁻⁶ Torr
  • 2-inch Ti, Mo, W, Ag, ITO, and IGZO targets
01.06
E-beam / thermal evaporator equipment

Laboratory system

E-beam / thermal evaporator

  • One thermal boat and three e-beam crucibles
  • Base pressure 1 × 10⁻⁶ Torr
  • Substrate heating to 650 °C
  • Pt, Au, Ag, Ti, Al, and Cr
01.07
Rapid thermal annealing system equipment

RTA

Rapid thermal annealing system

  • Room temperature to 1,000 °C
  • Temperature uniformity within ±1%
  • Vacuum, Ar, O₂, and N₂ ambient
  • Ultimate pressure below 5 × 10⁻³ Torr

Category 02

Device fabrication & processing

Surface preparation, chemical processing, and controlled sample handling.

02.01
Wet station equipment

Laboratory system

Wet station

  • Spin coater
  • Hot plate
  • Chemical drain
02.02
Plasma cleaner equipment

Laboratory system

Plasma cleaner

  • Surface cleaning and activation before deposition or bonding
02.03
UV/ozone treatment system equipment

Laboratory system

UV/ozone treatment system

  • 185 and 254 nm wavelengths
  • Up to 8-inch wafers

Category 03

Electrical characterization

DC, pulsed, capacitance, transport, and semiconductor parameter measurements.

03.01
Semiconductor parameter analyzer equipment

Keithley 4200A-SCS

Semiconductor parameter analyzer

  • DC I–V: 0.2 µV–210 V and 10 aA–1 A
  • C–V: 1 kHz–10 MHz with ±30 V DC bias
  • Pulsed I–V: ±40 V, ±800 mA, 200 MSa/s
03.02
Source measure unit equipment

Keithley 2635B

Source measure unit

  • 200 mV–200 V
  • 1 nA–1.5 A
  • Pulse width from 200 µs
03.03
High-voltage source meter equipment

Laboratory system

High-voltage source meter

  • Voltage to 1,100 V
  • Current to 1.00 A
  • 6.5-digit resolution
03.04
Arbitrary function generator equipment

Tektronix AFG31022

Arbitrary function generator

  • −5 V to 5 V DC
  • 1 mHz–20 MHz pulse frequency
  • 16 ns–999.99 s pulse width
  • Two channels
03.05
Probe station equipment

Laboratory system

Probe station

  • I–V and C–V measurement
  • Hot chuck from room temperature to 300 °C
  • Four manipulators

Category 04

Optical characterization

Absorption spectroscopy and calibrated optical-power measurements.

04.01
UV–visible spectrophotometer equipment

Laboratory system

UV–visible spectrophotometer

  • 190–1,100 nm wavelength range
  • 1 nm slit width
  • Photometric noise below 0.0002 A
04.02
Optical power meter equipment

Newport 843-R

Optical power meter

  • Handheld laser power meter
  • Measurement from pJ and pW to kilowatt-class optical power

Research access

Build, measure, and understand

For research collaboration or facility-related questions, contact EPID Laboratory.

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